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Resisting High Temperature Corrosion Titanium(Ti) Target

Chemical Composition:

              Chemistry  %
Grade Chief component Impurities  max
Ta Other Fe Si Ni W Mo Ti Nb O C H N
Ta1 Balance 0.004 0.003 0.002 0.004 0.004 0.002 0.03 0.015 0.004 0.0015 0.002
Ta2.5W Balance W2.0~3.5 0.01 0.005 0.005 — 0.02 0.003 0.05 0.015 0.01 0.002 0.01
Ta10W Balance W9.5~11 0.01 0.005 0.005 — 0.02 0.003 0.05 0.015 0.01 0.002 0.01
TaNb3 Balance Nb1.5~3.5 0.03 0.03 0.005 0.04 0.03 0.005 — 0.03 0.02 0.005 0.025
Note：Ta1=RO5200       Ta2.5W=RO5252     Ta10W=RO5255
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Description

Description

Titanium Target

Size : Rectangular target: L800mm×W200mm×H thickness of customer’s choice.(the largest size of similar products internationally)

          Circular target material: Ф 460 mm x H customer customize thickness (maximum size for the international similar products)

Density ≥ 99.9%TD,

A purity of 99.995% or more

The above three indicators are the highest level of domestic products, international advanced level

Purity : Purity is one of the main performance indexes of target, because the purity of target has a great influence on the performance of the film.However, in practical applications, the purity requirements of target materials are not the same.For example, with the rapid development of the microelectronics industry, the size of silicon wafer has been developed from 6 “, 8 “to 12”, and the wiring width has been reduced from 0.5 um to 0.25 um,0.18 um and even 0.13 um. In the past, the target purity of 99.995% can meet the technological requirements of 0.35 um IC, while the target purity of 0.18 um line is 99.999% or even 99.9999%.

Grain size and grain size distribution : The target material is usually polycrystalline, with grain sizes ranging from microns to millimeters.For the same target, the sputtering rate of the target with small grains is faster than that of the target with large grains.The thin films deposited by target sputtering with smaller grain size difference (uniform distribution) have more uniform thickness distribution.

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